Publications, extended abstracts, presentations, application notes, patents (available online if marked in blue)

 

L-Cell

U. Landau and E. Malyshev, “The L-Cell- A novel Device for Plating Process Characterization”, AESF/SURFIN 2004, Chicago, IL, June 2004.

L-Cell User’s Manual

Uziel Landau, “Electrochemical System for Analyzing Performance and Properties of Electrolutic Solutions”, US Patent No. 6,884,333. Granted April 26, 2005.

 

Anodization

R. Akolkar, U. Landau, H. Kuo and Yar- Ming Wang, Modeling of the Current Distribution in Aluminum Anodization, Abstract No. 686, session P1, 205th Electrochemical Society Meeting, San Antonio, TX, May 9- May 14 (2004).

R. Akolkar, U. Landau, H. Kuo and Yar- Ming Wang, “ Modeling of the Current Distribution in Aluminum Anodization”, General Motors Internal Research Publication, Warren, MI, 2003.

 

Interconnect metallization of semiconductor wafers

Uziel Landau, Metallization of Submicron Features in High-End Semiconductor Devices by Copper Electroplating, Invited Seminar, Energizer, Westlake OH , Feb. 4, 2005.

Uziel Landau, Eugene Malyshev, Rohan Akolkar, and Sergey Chivilikhin, Simulations of ‘Bottom-Up’ Fill In Via Plating Of Semiconductor Interconnects, Paper 189 d, session TK; Proceedings of the AIChE Annual Meeting, San-Francisco , CA , Nov 16-21 (2003).

Eugene Malyshev, Uziel Landau, and Sergey Chivilikhin, Modeling The Deposit Thickness Distribution In Copper Electroplating Of Semiconductor Wafer Interconnects, Paper 190 c, session TK; Proceedings of the AIChE Annual Meeting, San-Francisco, CA, Nov 16-21 (2003).

S. Chivilikhin, U. Landau, E. Malyshev, Current Distribution On A Resistive Wafer Under Copper Deposition Kinetics, Paper 190 b, session TK; Proceedings of the AIChE Annual Meeting, San-Francisco, CA, Nov 16-21 (2003).

Uziel Landau, “Copper Metallization of Semiconductor Interconnects – Issues and Prospects”, Invited Talk, CMP, Symposium, Abstract # 505, Electrochemical Society Meeting, Phoenix, AZ, October 22-27, 2000.

Yezdi Dordi, Uziel Landau, Jayant Lakshminkanthan, Joe Stevens, Peter Hey and Andrew Lipin, “Contact Resistance in Copper Plating of Wafers – Analysis and Design Criteria,” Abstract # 365, The Electrochemical Society Meeting, Toronto, Canada, May 2000.

Uziel Landau, John D’Urso, Andrew Lipin, Yezdi Dordi, Atif Malik, Michelle Chen, and Peter Hey, “A novel Electrolyte Composition for Copper Plating in Wafer Metallization”, Abstract No. 263, The Electrochemical Society Extended Abstracts, vol. 99-1, Seattle, Washington, May 2-6, 1999.

Uziel Landau and Rohan Akolkar, “Copper Metallization of Semiconductor Interconnects - Elucidation of a Controversial Mechanism Enabling a Key Technology”, Invited Lecture, The Electrochem. Soc., Cleveland Section, Cleveland OH , May 2004.

U. Landau, “ Metallization of Next Generation Semiconductor Devices by Copper Electroplating - Challenges and Prospects”, Invited Seminar, Dept. of Chemical Eng. , University of Rochester , Rochester , NY , March 27, 2002.

Uziel Landau, Invited Seminar: “Electroplating in Semiconductor Processing,” US Patent Office, Washington , DC , July, 2000.

 

Current/potential and deposit thickness distribution. Process and cell design

Uziel Landau, “Application of modelling to the design and scale-up of electroplating systems”, Forum ECHE M for Applied Electrochemistry, Feb. 26-28, 2003 , Vienna , Austria.

U. Landau, Computer-Based Simulations Providing Elusive and Unintuitive Results, Invited Presentation, in “ Modeling of Electrochemical Cells and Processes”, EAST ( European Academy of Surface Science) Forum 2002, Schwaebisch Gmuend , Germany . Oct. 10-11, 2002.

* Gary Marks, Daniel Blessington and Uziel Landau, "Thickness Distribution in Nickel Electroformed Ink-Jet Aperture Plates-Modeling and Experiments," Proceedings of the Electroforming Symposium AESF/SURFIN 91 meeting, Toronto , Canada , June, 1991.

* Uziel Landau, Norman L. Weinberg and Eliezer Gileadi, "Three Electrode Measurements in Industrial Cells,"J. Electrochem. Soc., 135 (1) 396-403, 1988.

* Uziel Landau, “Computer-Aided-Design for Electrochemical Data Extraction and it’s Application in Complex Systems,” Invited Talk, Interfinish 2000, Sept. 2000, Garmich , Germany.

"Design Considerations for Electrochemical Cells," Third Annual Chlorine/Chlorate Industry Seminar, Cleveland , Ohio , Nov. 10-12, 1987.

"Cell Design and Simulation," Symposium on "Electrochemistry As An Emerging High-Tech Area," Case Center for Electrochemical Sciences, 1986 Annual Conference, Cleveland , OH , Sept. 15-17, 1986.

"Modeling and Scale-Up of Electrochemical Cells," Alcoa Laboratories Centennial Technical Symposia 1986-1988, Pittsburgh , PA , June 2, 1986.

"Predictive Modeling of Electrochemical Cells," AT&T Bell Laboratories, Murray Hill , NJ , Nov. 30, 1985.

"Numerical Modeling of Current and Potential Distributions In Electrochemical Cells," Polytechnicum DiMilano , Italy , July 12, 1985.

"Modeling and Simulation of Electrochemical Cells," with W.J. Cook, SBIR Phase II Final Report, Contract No. DE-AC01-83ER80064, U.S. Dept. of Energy, Oct. 1987.

"Modeling and Simulation of Electrolytic Cells," with W. Jeffrey Cook, SBIR Phase I Final Report Helipump Corporation, contract No. DE-ACOs-83 ER 80064, Sept. 83-March 84, Department of energy, May 11, 1984.

W. Jeffery Cook and Uziel Landau, "Numerical Modeling of Current and Potential Distributions-Personal Computer Implementation," in "Engineering of Industrial Electrolytic Processes," U. Landau, R.E. White and R.J. Varjian, Eds., The Electrochemical Society Softbound Proceeding Series, Pennington, N.J., 1986.

 

Plating on non-conductors

* Dacong Weng and Uziel Landau, “Direct Electroplating on Non-Conductors”, J. Electrochem. Soc. 142 (8) 2598-2604 (1995).

* “Direct Electroplating on Non-Conductors”, Dacong Weng and Uziel Landau, Extended Abstract No. 3. The Electrochemical Society Extended Abstracts, Vol. 94-1, San-Francisco, CA. May 22-27, 1994.

 

Resistive electrodes

S. Chivilikhin, U. Landau, E. Malyshev, Current Distribution On A Resistive Wafer Under Copper Deposition Kinetics, Paper 190 b, session TK; Proceedings of the AIChE Annual Meeting, San-Francisco, CA, Nov 16-21 (2003).

Yezdi Dordi, Uziel Landau, Jayant Lakshminkanthan, Joe Stevens, Peter Hey and Andrew Lipin, “Contact Resistance in Copper Plating of Wafers – Analysis and Design Criteria,” Abstract # 365, The Electrochemical Society Meeting, Toronto, Canada, May 2000.

Uziel Landau, John D’Urso, Andrew Lipin, Yezdi Dordi, Atif Malik, Michelle Chen, and Peter Hey, “A novel Electrolyte Composition for Copper Plating in Wafer Metallization”, Abstract No. 263, The Electrochemical Society Extended Abstracts, vol. 99-1, Seattle, Washington, May 2-6, 1999.

 

Corrosion

"Modeling the Distribution of Corrosion Rates on Complete Structures and Their Cathodic Protection," with Murali M. Menon, paper No. 61g, AIChE 1986 Annual Meeting, Miami Beach , Florida , Nov. 2-7, 1986.

 

Reel-to-reel plating (‘strip plating’)

Uziel Landau, "Continuous Strip Plating - Design Consideration and Modeling," The Electrochemical Society Extended Abstracts, vol. 95-1, Reno , NV , May, 1995.

 

Alloy Plating

"Predictive Modeling of Ni-Fe Alloy Electrodeposition," with M. Frederick , Extended Abstract No. 313. The Electrochemical Society Extended Abstracts, Vol. 89-2, Hollywood , FL October 15-20, 1989 .

 

Additives effects

Uziel Landau, Eugene Malyshev, Rohan Akolkar, and Sergey Chivilikhin, Simulations of ‘Bottom-Up’ Fill In Via Plating Of Semiconductor Interconnects, Paper 189 d, session TK; Proceedings of the AIChE Annual Meeting, San-Francisco , CA , Nov 16-21 (2003).

Heidi B. Martin, Uziel Landau, and John C. Angus, “Analysis of Organic Plating Additives on Diamond Electrodes,” Symposium on Diamond Materials, The Electrochemical Society Meeting, Honolulu, October, 1999

 

Pulse and periodic reverse plating

* "Periodic Reverse Plating for Effective Leveling," Uziel Landau, Extended Abstract No. 615, The Electrochemical Society Extended Abstracts, Vol. 93-1, Honolulu , Hawaii , May 16-21, 1993.

"Pulse Plating-Advantages and Pitfalls," Invited talk at IBM Corp. Endicott, NY, Nov. 24, 1986.

 

STARRED ITEMS WILL BE AVAILABLE ONLINE IN .PDF OR .PPS FORMAT AT A LATER DATE

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